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23A256/23K256
256K SPI Bus Low-Power Serial SRAM
Device Selection Table
Part Number 23K256 23A256 VCC Range 2.7-3.6V 1.5-1.95V Page Size 32 Byte 32 Byte Temp. Ranges I, E I Packages P, SN, ST P, SN, ST
Features:
* Max. Clock 20 MHz * Low-Power CMOS Technology: - Read Current: 3 mA at 1 MHz - Standby Current: 4 A Max. at +85C * 32,768 x 8-bit Organization * 32-Byte Page * HOLD pin * Flexible Operating modes: - Byte read and write - Page mode (32 Byte Page) - Sequential mode * Sequential Read/Write * High Reliability * Temperature Ranges Supported: - Industrial (I): -40C to +85C -40C to +125C - Automotive (E): * Pb-Free and RoHS Compliant, Halogen Free
Description:
The Microchip Technology Inc. 23X256 are 256 Kbit Serial SRAM devices. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input. Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 23X256 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead TSSOP.
Package Types (not to scale)
Pin Function Table
Name CS SO VSS SI SCK HOLD VCC Function Chip Select Input Serial Data Output Ground Serial Data Input Serial Clock Input Hold Input Supply Voltage NC VSS 3 4 6 5 SCK SI CS SO 1 2 8 7 VCC HOLD PDIP/SOIC/TSSOP (P, SN, ST)
(c) 2009 Microchip Technology Inc.
DS22100D-page 1
23A256/23K256
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings ()
VCC.............................................................................................................................................................................4.5V All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +0.3V Storage temperature .................................................................................................................................-65C to 150C Ambient temperature under bias ...............................................................................................................-40C to 125C ESD protection on all pins ...........................................................................................................................................2kV NOTICE: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability.
TABLE 1-1:
DC CHARACTERISTICS
Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Min. 1.5 2.7 .7 VCC -0.3 -- VCC -0.5 -- -- -- -- -- -- Standby current -- -- 1 5 4 10 7 -- 1.2 -- A A pF V Typ(1) -- -- -- -- -- -- -- -- -- -- -- 200 Max. 1.95 3.6 VCC +0.3 0.2xVCC 0.2 -- 0.5 0.5 3 6 10 500 Units V V V V V V A A mA mA mA nA IOL = 1 mA IOH = -400 A CS = VCC, VIN = VSS OR VCC CS = VCC, VOUT = VSS OR VCC FCLK = 1 MHz; SO = O FCLK = 10 MHz; SO = O FCLK = 20 MHz; SO = O CS = VCC = 1.8V, Inputs tied to VCC or VSS CS = VCC = 3.6V, Inputs tied to VCC or VSS CS = VCC = 3.6V, Inputs tied to VCC or VSS @ 125C VCC = 0V, f = 1 MHz, Ta = 25C (Note 1) Test Conditions 23A256 (I-Temp) 23K256 (I,E-Temp)
DC CHARACTERISTICS Param. No. D001 D001 D002 D003 D004 D005 D006 D007 D008 Sym. VCC VCC VIH VIL VOL VOH ILI ILO ICC Read Operating current D009 ICCS Characteristic Supply voltage Supply voltage High-level input voltage Low-level input voltage Low-level output voltage High-level output voltage Input leakage current Output leakage current
D010 D011 Note 1: 2:
CINT VDR
Input capacitance RAM data retention voltage (2)
This parameter is periodically sampled and not 100% tested. Typical measurements taken at room temperature (25C). This is the limit to which VDD can be lowered without losing RAM data. This parameter is periodically sampled and not 100% tested.
DS22100D-page 2
(c) 2009 Microchip Technology Inc.
23A256/23K256
TABLE 1-2: AC CHARACTERISTICS
Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Min. -- -- -- -- 50 32 32 25 50 50 50 50 50 32 32 25 10 10 10 10 10 10 10 10 -- -- 50 32 32 25 50 32 32 25 50 32 32 25 -- -- -- -- 0 Max. 10 16 16 20 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2 2 -- -- -- -- -- -- -- -- -- -- -- -- 50 32 32 25 -- Units MHz MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns us us ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Test Conditions VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) Note 1 Note 1 VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) Note 1
AC CHARACTERISTICS Param. Sym. No. 1 FCLK Characteristic Clock frequency
2
TCSS
CS setup time
3
TCSH
CS hold time
4
TCSD
CS disable time
5
Tsu
Data setup time
6
THD
Data hold time
7 8 9
TR TF THI
CLK rise time CLK fall time Clock high time
10
TLO
Clock low time
11
TCLD
Clock delay time
12
TV
Output valid from clock low
13 Note 1:
THO
Output hold time
This parameter is periodically sampled and not 100% tested.
(c) 2009 Microchip Technology Inc.
DS22100D-page 3
23A256/23K256
TABLE 1-2: AC CHARACTERISTICS (CONTINUED)
Industrial (I): TA = -40C to +85C Automotive (E): TA = -40C to +125C Min. -- -- -- -- 10 10 10 -- Max. 20 20 20 20 -- -- -- 50 Units ns ns ns ns ns ns ns ns Test Conditions VCC = 1.5V (I-Temp) VCC = 1.8V (I-Temp) VCC = 3.0V (E-Temp) VCC = 3.0V (I-Temp) -- -- -- -- AC CHARACTERISTICS Param. Sym. No. 14 TDIS Characteristic Output disable time
15 16 17 18 Note 1:
THS THH THZ THV
HOLD setup time HOLD hold time HOLD low to output High-Z HOLD high to output valid
This parameter is periodically sampled and not 100% tested.
TABLE 1-3:
AC Waveform:
AC TEST CONDITIONS
0.1 VCC to 0.9 VCC 5 ns -40C to +125C -- 0.5 VCC 0.5 VCC
Input pulse level Input rise/fall time Operating temperature CL = 100 pF Input Output
Timing Measurement Reference Level:
DS22100D-page 4
(c) 2009 Microchip Technology Inc.
23A256/23K256
FIGURE 1-1:
CS 15 SCK 17 SO n+2 n+1 n High-Impedance 17 n 5 n n-1 n-1 16 15 16
HOLD TIMING
Don't Care SI HOLD n+2 n+1 n
FIGURE 1-2:
SERIAL INPUT TIMING
4
CS 2 7 11 8 3
SCK 5 SI 6 LSB in
MSB in
SO
High-Impedance
FIGURE 1-3:
SERIAL OUTPUT TIMING
CS 9 SCK 12 13 SO MSB out 14 LSB out 10 3
SI
Don't Care
(c) 2009 Microchip Technology Inc.
DS22100D-page 5
23A256/23K256
2.0
2.1
FUNCTIONAL DESCRIPTION
Principles of Operation
2.3
Read Sequence
The 23X256 is a 32,768-byte Serial SRAM designed to interface directly with the Serial Peripheral Interface (SPI) port of many of today's popular microcontroller families, including Microchip's PIC(R) microcontrollers. It may also interface with microcontrollers that do not have a built-in SPI port by using discrete I/O lines programmed properly in firmware to match the SPI protocol. The 23X256 contains an 8-bit instruction register. The device is accessed via the SI pin, with data being clocked in on the rising edge of SCK. The CS pin must be low and the HOLD pin must be high for the entire operation. Table 2-1 contains a list of the possible instruction bytes and format for device operation. All instructions, addresses and data are transferred MSB first, LSB last. Data (SI) is sampled on the first rising edge of SCK after CS goes low. If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD input and place the 23X256 in `HOLD' mode. After releasing the HOLD pin, operation will resume from the point when the HOLD was asserted.
The device is selected by pulling CS low. The 8-bit READ instruction is transmitted to the 23X256 followed by the 16-bit address, with the first MSB of the address being a "don't care" bit. After the correct READ instruction and address are sent, the data stored in the memory at the selected address is shifted out on the SO pin. If operating in Page mode, after the first byte of data is shifted out, the next memory location on the page can be read out by continuing to provide clock pulses. This allows for 32 consecutive address reads. After the 32nd address read the internal address counter wraps back to the byte 0 address in that page. If operating in Sequential mode, the data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses. The internal Address Pointer is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached (7FFFh), the address counter rolls over to address 0000h, allowing the read cycle to be continued indefinitely. The read operation is terminated by raising the CS pin (Figure 2-1).
2.2
Modes of Operation
2.4
Write Sequence
The 23A256/23K256 has three modes of operation that are selected by setting bits 7 and 6 in the STATUS register. The modes of operation are Byte, Page and Burst. Byte Operation - is selected when bits 7 and 6 in the STATUS register are set to 00. In this mode, the read/ write operations are limited to only one byte. The Command followed by the 16-bit address is clocked into the device and the data to/from the device is transferred on the next 8 clocks (Figure 2-1, Figure 2-2). Page Operation - is selected when bits 7 and 6 in the STATUS register are set to 10. The 23A256/23K256 has 1024 pages of 32 Bytes. In this mode, the read and write operations are limited to within the addressed page (the address is automatically incremented internally). If the data being read or written reaches the page boundary, then the internal address counter will increment to the start of the page (Figure 2-3, Figure 2-4). Sequential Operation - is selected when bits 7 and 6 in the STATUS register are set to 01. Sequential operation allows the entire array to be written to and read from. The internal address counter is automatically incremented and page boundaries are ignored. When the internal address counter reaches the end of the array, the address counter will roll over to 0x0000 (Figure 2-5, Figure 2-6).
Prior to any attempt to write data to the 23X256, the device must be selected by bringing CS low. Once the device is selected, the Write command can be started by issuing a WRITE instruction, followed by the 16-bit address, with the first MSB of the address being a "don't care" bit, and then the data to be written. A write is terminated by the CS being brought high. If operating in Page mode, after the initial data byte is shifted in, additional bytes can be shifted into the device. The Address Pointer is automatically incremented. This operation can continue for the entire page (32 Bytes) before data will start to be overwritten. If operating in Sequential mode, after the initial data byte is shifted in, additional bytes can be clocked into the device. The internal Address Pointer is automatically incremented. When the Address Pointer reaches the highest address (7FFFh), the address counter rolls over to (0000h). This allows the operation to continue indefinitely, however, previous data will be overwritten.
DS22100D-page 6
(c) 2009 Microchip Technology Inc.
23A256/23K256
TABLE 2-1: INSTRUCTION SET
Instruction Format Description Read data from memory array beginning at selected address Write data to memory array beginning at selected address Read STATUS register Write STATUS register
Instruction Name READ WRITE RDSR WRSR
0000 0011 0000 0010 0000 0101 0000 0001 BYTE READ SEQUENCE
FIGURE 2-1:
CS 0 SCK
1
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
Instruction SI 0 0 0 0 0 0 1
16-bit Address 1 15 14 13 12 2 1 0 Data Out 7 6 5 4 3 2 1 0
High-Impedance SO
FIGURE 2-2:
CS 0 SCK 1
BYTE WRITE SEQUENCE
2
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31
Instruction SI 0 0 0 0 0 0 1
16-bit Address 0 15 14 13 12 2 1 0 7 6
Data Byte 5 4 3 2 1 0
High-Impedance SO
(c) 2009 Microchip Technology Inc.
DS22100D-page 7
23A256/23K256
FIGURE 2-3:
CS 0 SCK Instruction SI 0 0 0 0 0 01 16-bit Address 1 15 14 13 12 2 1 0 Page X, Word Y 7 6 5 4 3 2 1 0 Page X, Word Y SO High Impedance 1 2 3 4 5 6 7 8 9 10 11 21 22 23 24 25 26 27 28 29 30 31
PAGE READ SEQUENCE
CS 32 33 34 35 36 37 38 39 SCK SI Page X, Word Y+1 SO 7 6 5 4 3 2 1 0 7 6 Page X, Word 31 5 4 3 2 1 0 7 6 Page X, Word 0 5 4 3 2 1 0
FIGURE 2-4:
CS 0 SCK 1 2
PAGE WRITE SEQUENCE
3
4
5
6
7
8
9 10 11
21 22 23 24 25 26 27 28 29 30 31 Page X, Word Y 2 1 0 7 6 5 4 3 2 1 0
Instruction SI 0 0 0 0 0 01
16-bit Address 0 15 14 13 12 Page X, Word Y
CS 32 33 34 35 36 37 38 39 SCK Page X, Word Y+1 SI 7 6 5 4 3 2 1 0 7 6 Page X, Word 31 5 4 3 2 1 0 7 6 Page X, Word 0 5 4 3 2 1 0
DS22100D-page 8
(c) 2009 Microchip Technology Inc.
23A256/23K256
FIGURE 2-5:
CS 0 SCK Instruction SI 0 0 0 0 0 01 16-bit Address 1 15 14 13 12 2 1 0 Page X, Word Y SO 7 6 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 10 11 21 22 23 24 25 26 27 28 29 30 31
SEQUENTIAL READ SEQUENCE
CS SCK SI
Page X, Word 31 SO 7 6 5 4 3 2 1 0 7
Page X+1, Word 0 6 5 4 3 2 1 0 7 6
Page X+1, Word 1 5 4 3 2 1 0
CS SCK
SI Page X+1, Word 31 SO 7 6 5 4 3 2 1 0 7 Page X+n, Word 1 6 5 4 3 2 1 0 7 Page X+n, Word 31 6 5 4 3 2 1 0
(c) 2009 Microchip Technology Inc.
DS22100D-page 9
23A256/23K256
FIGURE 2-6:
CS 0 SCK Instruction SI 0 0 0 0 0 01 16-bit Address 0 15 14 13 12 2 1 0 7 6 Data Byte 1 5 4 3 2 1 0 1 2 3 4 5 6 7 8 9 10 11 21 22 23 24 25 26 27 28 29 30 31
SEQUENTIAL WRITE SEQUENCE
CS 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 SCK Data Byte 2 SI 7 6 5 4 3 2 1 0 7 6 Data Byte 3 5 4 3 2 1 0 7 6 Data Byte n 5 4 3 2 1 0
DS22100D-page 10
(c) 2009 Microchip Technology Inc.
23A256/23K256
2.5 Read Status Register Instruction (RDSR)
The mode bits indicate the operating mode of the SRAM. The possible modes of operation are: 0 0 = Byte mode (default operation) 1 0 = Page mode 0 1 = Sequential mode 1 1 = Reserved Write and read commands are shown in Figure 2-7 and Figure 2-8. 0 W/R HOLD The HOLD bit enables the Hold pin functionality. It must be set to a `0' before HOLD pin is brought low for HOLD function to work properly. Setting HOLD to `1' disables feature. Bits 1 through 5 are reserved and should always be set to `0'. See Figure 2-7 for the RDSR timing sequence.
The Read Status Register instruction (RDSR) provides access to the STATUS register. The STATUS register may be read at any time. The STATUS register is formatted as follows:
TABLE 2-2:
7 W/R 6 W/R
STATUS REGISTER
5 - 0 4 - 0 3 - 0 2 - 0 1 - 0
MODE MODE
W/R = writable/readable.
FIGURE 2-7:
CS
READ STATUS REGISTER TIMING SEQUENCE (RDSR)
0 SCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Instruction SI 0 0 0 0 0 1 0 1
High-Impedance SO 7
Data from STATUS Register 6 5 4 3 2 1 0
(c) 2009 Microchip Technology Inc.
DS22100D-page 11
23A256/23K256
2.6 Write Status Register Instruction (WRSR)
The Write Status Register instruction (WRSR) allows the user to write to the bits in the STATUS register as shown in Table 2-2. This allows for setting of the Device operating mode. Several of the bits in the STATUS register must be cleared to `0'. See Figure 2-8 for the WRSR timing sequence.
FIGURE 2-8:
CS
WRITE STATUS REGISTER TIMING SEQUENCE (WRSR)
0 SCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
Instruction SI 0 0 0 0 0 0 0 1 7 6
Data to STATUS Register 5 4 3 2 1 0
High-Impedance SO
2.7
Power-On State
The 23X256 powers on in the following state: * The device is in low-power Standby mode (CS = 1) * A high-to-low-level transition on CS is required to enter active state
DS22100D-page 12
(c) 2009 Microchip Technology Inc.
23A256/23K256
3.0 PIN DESCRIPTIONS
3.5 Hold (HOLD)
The descriptions of the pins are listed in Table 3-1. The HOLD pin is used to suspend transmission to the 23X256 while in the middle of a serial sequence without having to retransmit the entire sequence again. It must be held high any time this function is not being used. Once the device is selected and a serial sequence is underway, the HOLD pin may be pulled low to pause further serial communication without resetting the serial sequence. The HOLD pin must be brought low while SCK is low, otherwise the HOLD function will not be invoked until the next SCK high-to-low transition. The 23X256 must remain selected during this sequence. The SI, SCK and SO pins are in a highimpedance state during the time the device is paused and transitions on these pins will be ignored. To resume serial communication, HOLD must be brought high while the SCK pin is low, otherwise serial communication will not resume. Lowering the HOLD line at any time will tri-state the SO line. Hold functionality is disabled by the STATUS register bit.
TABLE 3-1:
Name CS SO VSS SI SCK HOLD VCC
PIN FUNCTION TABLE
Function Chip Select Input Serial Data Output Ground Serial Data Input Serial Clock Input Hold Input Supply Voltage
PDIP/SOIC TSSOP 1 2 4 5 6 7 8
3.1
Chip Select (CS)
A low level on this pin selects the device. A high level deselects the device and forces it into Standby mode. When the device is deselected, SO goes to the highimpedance state, allowing multiple parts to share the same SPI bus. After power-up, a low level on CS is required, prior to any sequence being initiated.
3.2
Serial Output (SO)
The SO pin is used to transfer data out of the 23X256. During a read cycle, data is shifted out on this pin after the falling edge of the serial clock.
3.3
Serial Input (SI)
The SI pin is used to transfer data into the device. It receives instructions, addresses and data. Data is latched on the rising edge of the serial clock.
3.4
Serial Clock (SCK)
The SCK is used to synchronize the communication between a master and the 23X256. Instructions, addresses or data present on the SI pin are latched on the rising edge of the clock input, while data on the SO pin is updated after the falling edge of the clock input.
(c) 2009 Microchip Technology Inc.
DS22100D-page 13
23A256/23K256
4.0
4.1
PACKAGING INFORMATION
Package Marking Information
8-Lead PDIP
XXXXXXXX T/XXXNNN YYWW
Example:
23K256 I/P e3 1L7 0528
8-Lead SOIC (3.90 mm)
Example:
XXXXXXXT XXXXYYWW NNN
23K256I SN e3 0528 1L7
8-Lead TSSOP
XXXX TYWW NNN
Example:
K256 I837 1L7
Legend: XX...X T Y YY WW NNN
e3
Note:
Part number or part number code Temperature (I, E) Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code (2 characters for small packages) Pb-free JEDEC designator for Matte Tin (Sn)
For very small packages with no room for the Pb-free JEDEC designator e3 , the marking will only appear on the outer carton or reel label. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
Note:
DS22100D-page 14
(c) 2009 Microchip Technology Inc.
23A256/23K256
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DS22100D-page 16
(c) 2009 Microchip Technology Inc.
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DS22100D-page 17
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DS22100D-page 18
(c) 2009 Microchip Technology Inc.
23A256/23K256
APPENDIX A: REVISION HISTORY
Revision A (11/2008)
Original Release.
Revision B (12/2008)
Updates; Table 1-1, add Param. D011.
Revision C (01/2009)
Revised Section 2.5: Added a paragraph.
Revision D (04/2009)
Removed Preliminary status; Revised Standby Current; Revised Table 1-1, Param. No. D009; Revised TSSOP Package marking; Revised Product ID.
(c) 2009 Microchip Technology Inc.
DS22100D-page 19
23A256/23K256
NOTES:
DS22100D-page 20
(c) 2009 Microchip Technology Inc.
23A256/23K256
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information: * Product Support - Data sheets and errata, application notes and sample programs, design resources, user's guides and hardware support documents, latest software releases and archived software * General Technical Support - Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing * Business of Microchip - Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels: * * * * * Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Development Systems Information Line
Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http://support.microchip.com
CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip's customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.
(c) 2009 Microchip Technology Inc.
DS22100D-page 21
23A256/23K256
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________
From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: 23A256/23K256 Questions: 1. What are the best features of this document? Y N Literature Number: DS22100D FAX: (______) _________ - _________
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS22100D-page 22
(c) 2009 Microchip Technology Inc.
23A256/23K256
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Tape & Reel
-
X Temp Range
/XX Package
Examples:
a) b) 23K256-I/ST = 256 Kbit, 3.6V Serial SRAM, Industrial temp., TSSOP package 23A256T-I/SN = 256 Kbit, 1.8V Serial SRAM, Industrial temp., Tape & Reel, SOIC package 23K256-E/ST = 256 Kbit, 3.6V Serial SRAM, Automotive temp., TSSOP package
Device:
23A256 = 23K256 = Blank T I E = = =
256 Kbit, 1.8V, SPI Serial SRAM 256 Kbit, 3.6V, SPI Serial SRAM Standard packaging (tube) Tape & Reel -40C to+85C -40C to+125C
c)
Tape & Reel: Temperature Range:
Package:
P SN ST
= = =
Plastic PDIP (300 mil body), 8-lead Plastic SOIC (3.90 mml body), 8-lead TSSOP, 8-lead
(c) 2009 Microchip Technology Inc.
DS22100D-page 23
23A256/23K256
NOTES:
DS22100D-page 24
(c) 2009 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2009 Microchip Technology Inc.
DS22100D-page 25
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-6578-300 Fax: 886-3-6578-370 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/26/09
DS22100D-page 26
(c) 2009 Microchip Technology Inc.

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